PROCESS
CAPABILITES
| |
|
| |
Rigid
PCB (PCB) |
Flex
PCB (FCB) |
| |
|
|
| |
Layers:
1 ~ 20 |
Layers:
single side, suspend single side, double side, 3 & 4
layer, rigid-flex pcb |
| |
Material:
FR4, CEM-3, CEM-1 |
Material:
Polyimide (PI), Polyester(PET), Polyethylene(PE) |
| |
Copper
weight: Cu 1 oz, 2 oz, 3 oz, 4 oz |
|
| |
Mask
color: Green, Yellow, Bloack, Blue, Red.White |
Copper
type: Roll-annealed copper (RA), Electro-deposited
copper (ED) |
| |
Silk
color: White, Black, Yellow |
Surface
cover: Polyimide, Polyester, UV-cured mask, Ink,
Silver paste |
| |
Surface
finish: HASL, OSP, immersion gold, immersion silver,
gold plating |
Surface
plating: Ni-Au plating, Sn-Pb plating, HAL, Immersion
Ni-Au, Sn deposition, OSP. |
| |
Min
Trace/Space: 5 mil (0.127 mm) |
Stiffener
type: Polyimide, PET/PEN, Aluminum board, FR4,
PSA |
| |
Min
hole: NPTH-0.25 mm/PTH-0.20 mm |
Min
Trace/Space: 5 mil (0.127 mm) |
| |
Thickness:
0.1~3.2 mm |
Min
hole: NPTH-0.25 mm / PTH-0.2 mm |
| |
Max
size: 18"x24" (610x405 mm) |
Copper
thickness for PTH: >0.018 mm |
| |
Standards:
IPC-600 (Class II) |
Standards:
IPC/JPCA-6202 |
| |
|
|
